PACE TF2800 BGA and SMD Rework System

Dimensions

737mm (29") H x 1118mm (44") W x 965mm (38") D

Weight (Without Computer)

90kg (200lbs)

Top-side Heater

Inductive-Convection Heater, 300 Watts

Bottom Side Heater

Medium/Long wave IR, 1900 Watts; 405mm (16") x 405mm (16") || (1 x 1000 Watts & 6 x 150 Watts)

Bottom Heater Adjustable Height

Can be raised up to 38mm (1.5") closer to the PCB

Active Cooling Capability

Offers swift, yet controlled component/PCB cooling, directly through the nozzle

High Sensitivity Vacuum Pick 

Counterweight balanced with an optical sensor and precision high temperature linear ball bearings (includes 7 picks)

Precision Placement Capability

Placement system utilizes a stepper motor and position encoding for precise movement

Placement Accuracy

28μm (.0011") accuracy

Integrated Board Support Beam

2 standard supports, 1 x support wand & 1 x fixed center height adjustment, prevents PCBs from sagging or warping during rework and is extremely adjustable to clear parts on bottom of PCB.

Temperature Setting Range

Top Heater: 100˚ to 328˚C (212˚ - 624˚F); Bottom Heater: 100˚ to 221˚C (212˚ - 430˚F)

Max PCB Size

Maximum: 610mm x 610mm (24" x 24"); Minimum: N/A arms close down completely

Max/Min Component Size

Maximum: 65mm (2.5") x 65mm (2.5"); Minimum: 1mm Sq.

Thermocouple Inputs

Four (4) thermocouple inputs insure accurate profile development and real-time monitoring (includes 2 K-type thermocouples)

High Definition Optical Alignment

Vision Overlay System (VOS) with High Definition 1080p color camera

Vision Overlay System (VOS)

Contains integrated frame grabber and dichroic beam-splitting prism with independantly controlled LED lighting

VOS Zoom Capability

Up to 240x zoom capability, with Stable Zoom and image stabilization

Quad-Field Imaging

Allows up to four opposite corners of a large component (and its pads) to be viewed under higher magnification 

Single Axis Operation

All operations are complete in a single axis, eliminating risk of component movement after placement/reflow

Auxiliary Cooling Fan

Standard

Software

Intuitive, user-friendly, Windows software guides operators through profile development and execution

Computer System

Windows 10 PC, with wireless mouse and keyboard

Video Monitor

607mm (24") wide screen flat panel monitor (includes Monitor Arm Mounting Kit)

Maximum Airflow

Self contained pump, PC controlled, adjustable up to 30 SLPM

Component Nests

Two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement. Unique component holding system for parts under 5mm Sq.

Heat Focusing, Vented Nozzles

Over 90 nozzles available

Flux Application Plate

Included; allows for automated flux dipping

Stencils/Solder Paste Application

Over 145 stencil kits are optionally available (requires Universal Bracket Kit) and are integrated into the installation process

PV-65 Pik-Vac Vacuum Wand

Included; provides a manual vacuum pick-up capability for handling SMDs, with 15 minute auto-off feature