ISHIKAWA Solder paste (bottle) 8850 series
2024-02-06 12:21:52
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ISHIKAWA
Solder paste (bottle) 8850 series
Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
Flux type | Halogen free |
Halide contents | Less than 0.02% |
Powder particle size(μm) | 38~20(Type 4) |
Flux contents(%) | 11.5% |
Deterioration(Pa・S) | 190 |
Copper plate corrosion test | No corrosion |
Copper mirror corrosion | No corrosion |
Insulation resistance(Ω) | More than 5.0×108Ω |
Electrochemical migration | No migration |
Halogen contents(ppm) | Cl : Less than 900 |
Flux name | 8850 |