ISHIKAWA Solder paste (bottle) 8850 series

2024-02-06 12:21:52 admin

ISHIKAWA

Solder paste (bottle) 8850 series

 

Alloy type

J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
R4 (Sn:Bal / Ag 0.3 / Cu 0.7)

Flux type

Halogen free

Halide contents

Less than 0.02%

Powder particle sizeμm

3820(Type 4)

Flux contents(%)

11.5%

DeteriorationPaS

190

Copper plate corrosion test

No corrosion

Copper mirror corrosion

No corrosion

Insulation resistanceΩ

More than 5.0×108Ω

Electrochemical migration

No migration

Halogen contentsppm

Cl : Less than 900
Br : Less than 900

Flux name

8850


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