ISHIKAWA Solder paste (bottle) 8850 series
2024-02-06 12:21:52
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ISHIKAWA
Solder paste (bottle) 8850 series
Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
Flux type | Halogen free |
Halide contents | Less than 0.02% |
Powder particle size（μm） | 38～20(Type 4) |
Flux contents（％） | 11.5% |
Deterioration（Pa・S） | 190 |
Copper plate corrosion test | No corrosion |
Copper mirror corrosion | No corrosion |
Insulation resistance（Ω） | More than 5.0×108Ω |
Electrochemical migration | No migration |
Halogen contents（ppm） | Cl : Less than 900 |
Flux name | 8850 |
