KAIJO JAPAN FB-x26BUMP3 Wafer Level Bonder (Stud Bump)

Bonding area

Up to 200mm (8 “) (Manual transfer specification)

In case of automatic transfer specification, wafer circumference 2.5 mm become a non-bondable area. 
  e.g. Bonding range of 8" wafer is diameter 195mm

Productivity

Bonding time

30msec/bump (Pill-cut mode) 
40msec/bump (Fix-cut mode)

Indexing system

Wafer size

Up to 8"

Transportation

Semi-automatic transport (with Manual placing). 
*Full automatic transport is available with WHS-996(Option)

Others

Dimension

FB-x26BUMP3 : W1,132×D1,234×H1,728mm
WHS-996 : W680 x D1,190.5 x H1,424

Weight

FB-x26BUMP3 : 600kg
WHS-996 : 300kg