PACE IR3100 Infrared BGA Rework Station

Dimensions

737mm (29") H x 686mm (27") W x 737mm (29") D

Weight (Without Computer)

45kg (100lbs)

Top-side Heater

Medium/Long wave IR, 500 Watts

Bottom-side Preheater

Medium/Long wave IR, 1000 Watts; 220mm (8.6”) x 155mm (6.1”)

Bottom-side Preheater Working Height

Adjustable working height from lowest position up to 38mm (1.5”) closer to the PCB

High Sensitivity Vacuum Pick

Pick is counterweight balanced, and utilizes an optical sensor and precision high temperature linear ball bearings, ensuring delicate placement and pick up of parts from PCB. Includes six (6) Vacuum Picks

Precision Placement Capability

Advanced professional placement system utilizing a stepper motor and position encoding provides smooth, precise movement, with no drift, allowing for repeatable and accurate placement.

Placement Accuracy

Stepper motor with precision positioning of to 28μm (.0011”) accuracy

Board Support Capability

Integrated Board Support Wand prevents PCBs from sagging/warping during rework and is adjustable to clear parts on bottom of PCB

Maximum Target Temperature

Each profile zone has a maximum target temperature of 328 °C (624 °F)

Precision PCB Holder

Advanced table features micrometer X & Y adjustment, extruded board holder arms, spring loaded, with T-slots and movable clamps for both large and irregularly shaped boards with non-uniform edges

Maximum/Minimum PCB Size Maximum

305mm x 305mm (12” x 12”); Minimum: N/A arms close down completely.

Maximum/Minimum Component Size Maximum

65mm (2.5”) x 65mm (2.5”); Minimum: 1mm Sq.

IR Pyrometer and Thermocouple Inputs

A specially developed IR sensor provides non-contact, real-time, closed-loop temperature control throughout the reflow process. In addition, four (4) thermocouple inputs provide additional real-time monitoring (includes 2 K-type thermocouples)

High Definition Optical Alignment System

Vision Overlay System (VOS) with High Definition (1080p) color camera, integrated frame grabber, dichroic beam-splitting prism, independently controlled LED illumination for component and PCB. Up to 240x zoom capability and Stable Zoom.

Motorized Optics Housing (Sodr-Cam

Allows the developer to watch the entire reflow process in real time to verify solder melt. The camera arm rotates to provide a 180-degree view at a fixed distance, for minimal focus adjustment and ease of use.

Quad-Field Imaging

For large component alignment (including fine-pitch QFPs), allows up to four opposite corners of a large component (and its pads) to be viewed under higher magnification

Single Axis Operation

All operations, including component pick-up, alignment, placement, reflow & active cooling are completed in a single axis, eliminating risk of component movement after placement and reflow.

Auxiliary Cooling Fan

Standard, for secondary cooling of the PCB

Component Nests

Two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement. Optional component holding system for parts under 5mm Sq.

Flux Dip Plate

Included; allows for automated flux dipping

Stencils/Solder Paste

Over 145 stencil kits are optionally available (requires Universal Bracket Kit) and are integrated into the installation process