PACE IR4100 Infrared BGA and SMD Rework Station

230 VAC Unit Power Requirement

230 VAC, 50 Hz (2400 Watts maximum) Requires dedicated 10 A supply

Dimensions

737mm (29”) H x 1118mm (44”) W x 965mm (38”) D

Weight (Without Computer)

90kg (200lbs)

Bottom-side Preheater

Medium/Long wave IR, 1900 Watts with array of 7 IR emitters capable of preheating large, high mass assemblies

Adjustable Bottom Heater Working Height

Adjustable working height from lowest position up to 38mm (1.5”) closer to the PCB

Sensitivity Vacuum Pick

Pick is counterweight balanced,and utilizes an optical sensor and precision high temperature linear ball bearings ensuring delicate placement and pick up of parts from PCB. Includes six (6) Vacuum Picks

Precision Placement Capability

Advanced professional placement system utilizing a stepper motor and position encoding provides smooth, precise movement, with no drift, allowing for repeatable and accurate placement

Placement Accuracy

Stepper motor with precision positioning of to 28μm (.0011") accuracy

Board Support Capability

Incorporates adjustable/removable Board Support Beam; Plus up to four stationary adjustable height support pins; Prevents PCBs from sagging/warping during rework

Maximum Target Temperature

Each profile zone has a maximum target temperature of 328 degrees C. (624 degrees F)

Precision PCB Holder

Advanced table features micrometer X & Y adjustment, extruded board holder arms, spring loaded, with T-slots and movable clamps for both large and irregularly shaped boards with non-uniform edges

Maximum/Minimum PCB Size

Maximum: 610mm x 610mm (24” x 24”); Minimum: N/A

Maximum/Minimum Component Size

Maximum: 65mm (2.5") x 65mm (2.5"); Minimum: 1mm Sq.

IR Pyrometer and Thermocouple Inputs 

A specially developed IR sensor provides non-contact, real-time, closed-loop temperature control throughout the reflow process. In addition, four (4) thermocouple inputs provide additional real-time monitoring (includes 2 K-type thermocouples)

High Definition Optical Alignment System 

Vision Overlay System (VOS) with High Definition (1080p) color camera, integrated frame grabber, dichroic beam-splitting prism, independently controlled LED illumination for component and PCB. Up to 240x zoom, and doesn't need routine calibration

Sodr- Cam

Allows the developer to watch the entire reflow process in real time to verify solder melt. The camera arm rotates to provide a 180-degree view at a fixed distance, for minimal focus adjustment and ease of use.

Motorized Optics Housing

Automatically controlled, retractable optics housing protects Vision Overlay System from dirt and contamination

Quad-Field Imaging

For large component alignment (including fine-pitch QFPs), allows up to four opposite corners of a large component (and its pads) to be viewed under higher magnification

Single Axis Operation

All operations, including component pick-up, alignment, placement, reflow & active cooling are completed in a single axis, eliminating risk of component movement after placement and reflow

Auxiliary Cooling Fan

Standard, for secondary cooling of the PCB

Software

Intuitive, user-friendly, Windows-compatible software guides operators through profile development and execution; No cost upgrades on IR3100/4100 software

Computer System

Windows 10 PC with wireless mouse/keyboard

Video Monitor

607mm (24") wide screen flat panel monitor (includes Monitor Arm Mounting Kit)

Video Inputs

USB 3.0

Component Nests

Two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement. Unique component holding system for parts under 5mm Sq.

Flux Dip Plate

Included: allows for automated flux dipping

Stencils/Solder Paste Application

Over 145 stencil kits are optionally available (requires Universal Bracket Kit) and are integrated into the installation process

PV-65 Pik-Vac Vacuum Wand

Included: provides a manual vacuum pick-up capability for handling SMDs, incorporates new 15-minute auto-off feature