KAIJO JAPAN DBX-1000 Epoxy Die Bonder

Bonding speed

0.18second / cycle (Excluding process time)

Bonding accuracy

Position : ±25μm(3σ)
Angle : ±3°(3σ)

Die size

□0.15 - □1.5mm

Package size

Width : 20 - 100mm
Length : 90 - 230mm
Thickness : 0.1 - 2mm

Magazine size

Width : 30 - 110mm
Length : 95 - 235mm
Height : 100 - 175mm
Stockable quantity : 2 - 3 magazines

Wafer size

4 inch grip ring (Outer dia. Φ152mm)
6 inch grip ring （Outer dia. φ210mm） / OP

Overall dimensions

W1,750×D1,080×H2,050mm (Including indication lamp)

Weight

930kg