KAIJO JAPAN EDB-2000 Epoxy Die Bonder
2024-03-25 14:07:27
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KAIJO JAPAN
EDB-2000
Epoxy Die Bonder
Bonding system | Eutectic die bonding |
Bonding speed | SM：1sec ,LD：2sec |
Bonding Temperatuire | -400°C (Heater Block -500°C) |
Chip size | □0.15 - □1.5mm |
Stem type & Stem size | TO-Can |
Ring type & Ring size | Double ring |
Tray size | W 85mm - 180mm |
Overall dimensions | W1,500×D1,040×H2,000mm |
Weight | 1,000kg |
