KAIJO JAPAN EDB-2000 Epoxy Die Bonder

2024-03-25 14:07:27 admin

KAIJO JAPAN

EDB-2000

Epoxy Die Bonder

 

Bonding system

Eutectic die bonding

Bonding speed

SM:1sec ,LD:2sec
4.8sec/2chip

Bonding Temperatuire

-400°C (Heater Block -500°C)

Chip size

0.15 - □1.5mm

Stem type & Stem size

TO-Can
(TO-33 ~ TO-9 L < 16mm)

Ring type & Ring size

Double ring
8 inch ring for 6 inch wefar
(OD:210mm, ID:195mm) Tray

Tray size

W 85mm - 180mm
D 85mm - 180mm
H 14mm - 30mm

Overall dimensions

W1,500×D1,040×H2,000mm

Weight

1,000kg

 


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