KAIJO JAPAN FB-x26BUMP1 Wafer Level Bonder (Stud Bump)
2024-03-25 14:07:56
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KAIJO JAPAN
FB-x26BUMP1
Wafer Level Bonder (Stud Bump)
Bonding | Bonding accuracy | 3σ≦3.0μm |
Bonding area | 4" wafer : Diameter 95mm | |
Productivity | Bonding time | 30msec/bump (Pill-cut mode) |
Indexing system | Wafer size | Up to 6" |
Transportation | Automatic transport with Carrier | |
Magazine size | Width:176mm | |
Others | Dimension | W1,292×D1,240×H1,728mm |
Weight | 550kg |
