CEMEDINE Epoxy Resin Adhesive (Heat curing type) - EP138,EP106NL,EP116new,EP171,EP170,EP170-2,EP160,EP811 One Component Epoxy Adhesives
                            2024-06-26 15:23:50
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                    CEMEDINE
Epoxy Resin Adhesive (Heat curing type) - EP138,EP106NL,EP116new,EP171,EP170,EP170-2,EP160,EP811
One Component Epoxy Adhesives
Specifications:
Multi-purpose type
| EP138 | EP106NL | EP116新 | EP171 | |||
|---|---|---|---|---|---|---|
| Application / Properties / Features | High-viscosity non-sag type | Low-viscosity flow type | Low-viscosity flow type/High peel-resistant type | Low-temperature curing type | ||
| Type | One-Part Heat Curing Epoxy Adhesive | |||||
| Base | Epoxy resin | Epoxy resin | Epoxy resin | Epoxy resin | ||
| Appearance | Light yellowish brown | Milky white | Gray | Light brown | ||
| Viscosity | Pa・s/23℃ | 240 | 22 | 10.7 | 50 | |
| Density | g/cm3 | 1.4 | 1.18 | 1.2 | 1.19 | |
| Standard curing conditions | 120℃×30min | 120℃×40min | 150℃×20min | 80℃×30min | ||
| 150℃×20min | 140℃×30min | 120℃×10min | ||||
| Tensile Shear Strength | MPa | 25.6 | 24.1 | 30.4 | 22.1 | |
| T-Peel Strength | N/mm | 3.06 | 3.48 | 4.6 | 0.2 | |
| Cured properties | Hardness | Shore D | 88 | 84 | 80 | 87 | 
| Glass transition temperature | ℃ | 122 | 91 | 96 | 83 | |
| Elastic modulus | MPa | 1215 | ||||
| Curing Shrinkage Rate | % | 0.53 | ||||
| Water Absorption Ratio | % | 0.1 | 0.14 | 0.13 | ||
| Linear Expansion Coefficient | 5.7×10-5 | 7.8×10-5 | 7.6×10-5 | 6.0×10-5 | ||
| Electric Characteristics | Volume Resistivity | Ω・cm | 3.0×1015 | 2.6×1015 | 3.0×1015 | |
| Surface Resistivity | Ω/sq | 6.6×1015 | ||||
| Insulation Breakdown Voltage | kV/mm | 16< | ||||
| Dielectric Constant | 100Hz | 4.7 | 3.6/1kHz | |||
| Dielectric Loss Tangent | 100Hz | 0.01 | 0.01/1kHz | |||
| Storage temperature | ℃ | 0~10 | 0~10 | 0~10 | 0~10 | |
| Capacity | 1kg | 1kg | 1kg | 1kg | ||
| 3kg | 3kg | 20kg | 20kg | |||
Flexible type
| EP170 | EP170-2 | |||
|---|---|---|---|---|
| Application / Properties / Features | High peel-resistant type | High peel-resistant type /Non-sag type | ||
| Type | One-Part Heat Curing Epoxy Adhesive (Flexible type) | |||
| Base | Epoxy resin | Epoxy resin | ||
| Appearance | Light yellow | Light yellow | ||
| Viscosity | Pa・s/23℃ | 170 | 340 | |
| Density | g/cm3 | 1.13 | 1.12 | |
| Standard curing conditions | 110℃×60min | 110℃×60min | ||
| 120℃×30min | 120℃×30min | |||
| Tensile Shear Strength | MPa | 15.1 | 10.8 | |
| T-Peel Strength | N/mm | 6.67 | 6.6 | |
| Cured properties | Hardness | Shore D | 55 | |
| Glass transition temperature | ℃ | 20 | ||
| Water Absorption Ratio | % | 0.23 | ||
| Linear Expansion Coefficient | 30×10-5 | |||
| Electric Characteristics | Volume Resistivity | Ω・cm | 3.0×1015 | |
| Capacity | 1kg | 1kg | ||
Heat resistance type
| EP160 | |||
|---|---|---|---|
| Application / Properties / Features | Heat-resistant type /Medium viscosity | ||
| Type | One-Part Heat Curing Epoxy Adhesive | ||
| Base | Epoxy resin | ||
| Appearance | Light brown | ||
| Viscosity | Pa・s/23℃ | 100 | |
| Density | g/cm3 | 1.16 | |
| Standard curing conditions | 110℃×60min | ||
| 120℃×30min | |||
| Tensile Shear Strength | MPa | 16.8 | |
| T-Peel Strength | N/mm | 1.18 | |
| Cured properties | Hardness | Shore D | 85 | 
| Glass transition temperature | ℃ | 140 | |
| Elastic modulus | MPa | 414 | |
| Breaking Strength | N/mm2 | 22.6 | |
| Elongation At Break | % | ||
| Curing Shrinkage Rate | % | 2.43 | |
| Water Absorption Ratio | % | 0.05 | |
| Linear Expansion Coefficient | 6.5×10-5 | ||
| Electric Characteristics | Volume Resistivity | Ω・cm | 2.6×1015 | 
| Surface Resistivity | Ω/sq | ||
| Insulation Breakdown Voltage | kV/mm | ||
| Dielectric Constant | 100Hz | 4.5 | |
| Dielectric Loss Tangent | 100Hz | 0.011 (1kHz) | |
| Capacity | 1kg | ||
Potting electronics
| EP811 | |||
|---|---|---|---|
| Application / Properties / Features | Flow type | ||
| Type | One-Part Heat Curing Epoxy Adhesive | ||
| Base | Epoxy resin | ||
| Appearance | Black | ||
| Viscosity | Pa・s/23℃ | 82 | |
| Density | g/cm3 | 1.71 | |
| Standard curing conditions | 120℃×30min | ||
| Tensile Shear Strength | MPa | 19.7 | |
| Cured properties | Hardness | Shore D | 91 | 
| Glass transition temperature | ℃ | 134 | |
| Elastic modulus | MPa | 6600 | |
| Poisson's ratio | 0.3 | ||
| Breaking Strength | MPa | 59 | |
| Elongation At Break | % | 1.19 | |
| Water Absorption Ratio | % | 0.05 | |
| Linear Expansion Coefficient | 25 | ||
| Electric Characteristics | Volume Resistivity | Ω・cm | 5.0×1015 | 
| Insulation Breakdown Voltage | kV/mm | 22< | |
| Dielectric Constant | 100Hz | 5.2 | |
| Dielectric Loss Tangent | 100Hz | 0.1 | |
| Capacity | 4kg | ||
| 10kg | |||
 
                     
                                                                         
                     