OMRON ​VT-S1080-V2.0 VT-S1040-V2.0 VT-Z600-V2.0 PCB Inspection System

2024-08-08 16:16:16 admin

OMRON

VT-S1080-V2.0         VT-S1040-V2.0          VT-Z600-V2.0

PCB Inspection System

 

Specifications:

Type

VT-S1080-V2.0

VT-S1040-V2.0

VT-Z600-V2.0

Outer dimentions

1180(W) x 1450(D) x 1500(H)mm (excluding tower lamp and monitor)

Weight

Approx. 1240Kg

Power supply

200 to 240 V AC (Single phase); Voltage fluctuation range ±10% 50/60Hz

Rated power

2.0 kVA (Maximum current 10 A)

Line height

900±20mm

Air supply

Not required

Operating temperature 
range

1035℃

Operating humidity 
range

35 to 80% RH (Non-condensing)

Camera

Direct

25Mpix

Oblique

5Mpix

-

-

Resolution

Direct

12.5μm

Oblique

10μm

-

-

FOV

Direct

52.5 x 52.5mm

Oblique

25.9 x 19.4mm

-

-

Inspection principle

Hybrid 3DShape 
reconstruction 
MDMC*12 
illumination+Phase shift 
(MPS *13)

Hybrid 3DShape 
reconstruction 
MDMC*12 
illumination+Phase shift 
(MPS *13*14)

2.5D Shape reconstruction 
MDMC*12 illumination

Supported
PCB size

Size

Single lane: 50(W) x 50(D)510(W) x 680(D)mm 
Dual lane: 50(W) x 50(D)
510(W) x 330(D)mm

Thickness

0.44mm

Weight

4Kg

Clearance

Clearance on PCB: 50mm from board surface 
Clearance under PCB: 50mm from the back of the board 
(including PCB warpage, deflection, component tolerance, etc.)

Height measurement 
range

25.4mm

-

Inspection item

Component height, lift, tilt, missing or wrong component, 
wrong polarity, flipped component, OCR inspection, 
2D code, component offset (X/Y/rotation), 
fillet*15 (height/length, end joint width, wetting angle, 
side joint length), exposed land, foreign material, 
land error, lead offset, lead posture, lead presence, 
solder ball, solder bridge, distance between components,
component angle

Missing or wrong component, 
wrong polarity, flipped component, 
OCR inspection, 2Dcode, 
component offset (X/Y/rotation), 
fillet (height/length, end joint width, 
wetting angle, side joint length)*15, 
exposed land, foreign material, 
land error, lead offset, lead posture,
lead presence, solder ball, 
solder bridge, distance between 
components, component angle

 

 


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