OMRON ​VT-X750 High-speed automated X-ray CT inspection system

Model

VT-X750

VT-X750-XL

Type

V3-H

V3-C

V3

Inspection object

BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side terminal 
components, QFN, Power devices, POP, Press-fit CN, etc.

Inspection items

Void, open, non-wet, Solder Volume, shifting, foreign object, bridging, Solder fillet, 
TH Solder filling, Solder ball, etc. (selectable to applications)

Imaging
system

Method

3D-slice imaging by using parallel CT

Resolution

6,8,10,15,20,25,30µm/pixel
(selectable in the 
inspection program)

3, 6,8,10,15,20,25,30µm/pixel 
(selectable in the 
inspection program)

10,15,20,25,30µm/pixel 
(selectable in the 
inspection program)

X-ray source

Micro-fucus closed tube

X-ray detector

Flat panel detector

PCBA

Size

50x50～610x515 mm (2x2 to 24x20 inch), 
Thickness：0.4～5.0 mm (0.4～3.0 mm in 3 µm resolution)

100x100～1200x660 mm, 
Thickness：0.4～15.0 mm

Weight

Less than 4.0 kg, less than 8.0 kg (option)

Less than 15 kg

Component 
clearance 
*Maximum

Top: 40 mm, 90 mm (option)

Top: 40 mm, Bottom: 50 mm

Warpage

Less than 2.0 mm (Less than 1.0 ｍｍ in 3 µm resolution)

Less than 3.0 mm

Main 
body

Footprint

1,550(W) x 1,925(D) x 1,645(H) mm

2,180(W)×2,510(D)×1,735(H) mm

Weight

Approx. 3,100 kg

Approx. 5,350 kg

Conveyor 
height

900 ±20 mm

Power supply

Single phase, 200 to 240 VAC, 50/60 Hz

Rated power

2.4kVA

2.58kVA

X-ray leakage

Less than 0.5 µSv/h

Air supply

0.4 to 0.6 Mpa

Safety 
standard

CE, SEMI, NFPA, FDA

CE, FDA