CEMEDINE EP001K Epoxy Resin Adhesive
2024-06-26 15:12:47
admin
CEMEDINE
EP001K
Epoxy Resin Adhesive
Specifications:
| EP001K | ||||
|---|---|---|---|---|
| Base resin | Hardener | |||
| Application / Properties / Features | Elasticity | |||
| Type | Two-part epoxy adhesive curing at room temperature | |||
| Base | Epoxy resin | Silyl terminated polyether | ||
| Appearance | Milky white | Light yellow | ||
| Non-volatiles | wt% | 99 | 97 | |
| Viscosity | Pa･s/23°C | 14 | 18 | |
| Density | g/cm3 | 1.15 | 1.00 | |
| Standard curing conditions | 23°C×7days | |||
| 23°C 3days＋50°C 3days | ||||
| Mixing ratio | 1 : 1 | |||
| Pot life | 23°C | 11分 | ||
| Set time | 23°C | 40 min. | ||
| 23°C | 24 hours | |||
| Cured properties | Hardness | Shore A | 72 | |
| Glass transition temperature | °C | -65 | ||
| Elastic modulus | MPa | 3.2 | ||
| Breaking strength | MPa | 6.7 | ||
| Elongation at break | % | 200 | ||
| Water absorption ratio | % | 1.8 | ||
| Linear expansion coefficient | 15×10-5 | |||
| Capacity | 320ml set | |||
| 2kg set | ||||
